Iakov Sergeev
U.S. Permanent Resident (DV1 Visa) – relocating to the U.S. in December 2025. Eligible to work in the United States without sponsorship.
Senior Electrical / Hardware Prototype Engineer
Summary:
Experienced Electrical and Hardware Prototype Engineer with over 10 years in electronics design, embedded systems, and product development.
Skilled in schematic and PCB design, RF tuning, ME engineering and end-to-end prototyping - from concept to production.
Hands-on experience writing and debugging firmware in C for microcontrollers. Confident in reading, understanding, and modifying existing code.
Extensive practical experience with 3D printing (FDM and DLP) and CNC machining for rapid prototyping and mechanical validation.
Proven record of leading hardware projects, coordinating with firmware and mechanical teams, and supporting manufacturing abroad
Co-inventor on 28 U.S. patents, demonstrating strong innovation, teamwork, and practical problem-solving skills.
Patents: justia.com/search?q=iakov+sergeev
Project examples: https://rtphex.com/projects
Professional experience:
CTO – Orber Technologies Inc.
(Oct 2022 – Present)
Lead prototyping and development of a compact “selfie drone” with a radio-tether control system.
Designed electronic schematics and multilayer PCBs.
Participated in development of embedded firmware in C for wireless control and sensor integration.
Created mechanical assemblies, built prototypes, conducted testing, and performance tuning.
Oversaw all stages of hardware development from concept to functional prototype with budget of over $500k
Hardware Lead – Finch XR Ltd.
(Sep 2015 – Oct 2022)
Designed and developed controllers for Virtual and Augmented Reality devices.
Selected electronic components, designed schematics and PCBs for mass production.
Collaborated closely with firmware and mechanical engineering teams to ensure product integration.
Tuned RF circuits and antennas, matched impedances, prepared devices for FCC and CE certification.
12-month assignment in China to support manufacturing setup and implement test automation equipment.
Managed prototyping, validation, and transition to mass production for the devices with budget over $2M.
Hardware Engineer – Flipper Devices Inc.
(Sep 2020 – Feb 2021)
Developed power management circuits, RFID antennas, and BLE communication subsystems.
Prototyped and validated power management subsystem, RFID antennas PCBs, measured electrical and RF parameters, tuned antennas and matched impedances.
Contributed to iterative hardware design improvements through rapid testing and measurement cycles.
Service Engineer - Ufanet
(Feb 2013 – Sep 2015)
Repaired and maintained telecommunication hardware and UPS systems.
Developed remote monitoring systems for telecommunications infrastructure.
Built home automation (“smart home”) solutions and hardware interfaces.
Technical skills:
· Hardware Design: Schematic and multilayer PCB design using Altium Designer, DipTrace, and Eagle CAD.
Skilled in developing and debugging:
Energy-efficient (sub uA) power systems, PMICs, DC/DC and high-voltage converters, Li-ion battery chargers, and ripple voltage mitigation techniques;
Proficient in high-speed interface design and signal integrity optimization for mixed-signal systems;
Hardware systems integrating: IMUs, displays, touchpads, Hall sensors, magnetic encoders, interface converters, RF modules, NFC/RFID, BCI interfaces, memory IC’s and devices, ToF and optical sensors, LiDARs, audio amplifiers (Class A, AB, D), instrumentation amplifiers, LED drivers, vibration actuators and motor drivers (DC, BLDC, stepper).
· Embedded Systems: Programming in C for nRF52 and similar MCUs; firmware debugging and hardware bring-up.
· Mechanical Design: Enclosure and mechanism design using Autodesk Fusion 360.
· RF & Measurement: RF circuit tuning, impedance matching; experienced using spectrum analyzers, VNAs, and antenna measurement setups.
· Prototyping & Testing: Extensive experience with 3D printing (FDM/DLP), CNC machining, assembling prototypes, testing, and troubleshooting electronic systems using oscilloscopes, multimeters, and soldering tools.
· Manufacturing & Certification: DFM/DFT, test jig development, FCC/CE compliance and production coordination in China.
· Collaboration Tools: Jira, Zoho, Clickup and Confluence for technical documentation